H2000

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H2000侧面
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H2000正面
  • H2000侧面.png
    H2000侧面
  • H2000正面.png
    H2000正面
Precision Solder Paste Printing Equipment
H2000
Product Features

Large size · Equally powerful

1. Horizontal (X-direction) adaptive printing structure;

2. High precision and large printing platform;

3. New CCD system with closed-loop MES;

4. High compatibility, suitable for all sizes of substrates;

5. Many intelligent and upgradable functions.


Product Application

Suitable for 5G, LED, new energy, backlight and other large scale substrate printing fields, solder paste, red glue, copper paste, steel mesh, screen and other printing processes.

Product Parameters
H2000 Series
Maximum substrate size 2000*510mm
Minimum substrate size 80*50mm
Substrate thickness dimensions 0.8 ~ 6 mm
Steel mesh frame dimensions 720*300mm~2300*737mm (thickness: 20-40mm)
Transmission direction Left in right out, right in left out, same in same out
Cleaning method Wet wipe, dry wipe, vacuum wipe
Power requirement AC:220 ±10%, 50/60Hz 3KW
Equipment size L3108mm*W1350mm*H1635mm(without tri-color light)


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