H900

H900正面图.png
H900正面图
  • H900正面图.png
    H900正面图
Precision Solder Paste Printing Equipment
H900
Product Features

1. High-precision LED chip lamp with special equipment, with special solidification equipment, can provide special whole line equipment and process plan;

2. Programmable suspension horizontal (X-direction) adaptive printing structure to ensure pressure stability;

3. Equipped with 1.3 million pixel digital camera, 10*8mm FOV field of view, perfectly compatible with all types/coating MARK;

4.GKG standard MES system can collect equipment parameters, debugging information, material monitoring and information capture, and realize the ability to control the output link in real time and comprehensively trace the production data.


Product Application

Suitable for outdoor advertising display, supermarket, hotel and other COB chip flexible lamp packaging field, compatible with solder paste and other multi-process.

Product Parameters
H900 Series
Maximum substrate size 900mm*360mm (can be upgraded to 900*400mm)
Minimum substrate size 80*50mm
Substrate thickness dimensions 0.8 ~ 6 mm
Steel mesh frame dimensions 720*300mm~1200*750mm
Transmission direction Left in right out, right in left out, same in same out
Cleaning method Wet wipe, dry wipe
Power requirement AC:220 ±10%, 50/60Hz 2.2KW
Equipment size L1970mm*W1210mm*H1509mm(without tri-color light)


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