C100

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Precision Solder Paste Printing Equipment
C100
Product Features

The pursuit of innovation, therefore excellence

Climber·C100 is a high-precision application equipment of GKG Cohesive core technology;

2. One general purpose to meet a variety of semiconductor packaging process printing;

3. Real-time pressure closed-loop system, real-time pressure correction accuracy ±0.2Kg;

4. Intelligent testing system to ensure the stability of the production process;

5.GKG integrated central control center + "Customized" Industry 4.0+ intelligent options to achieve industrial intelligence and production process information.


Product Application

Suitable for substrate level semiconductor packaging and printing, and compatible with chip, wafer packaging and printing processes. It can be connected with Gsemi-S ball planting machine to form printing + ball planting line, which improves the flexibility of the whole line.

Product Parameters
C100 Series
Maximum substrate size 510 x 510mm (can be upgraded to: 610 x 510mm)
Minimum substrate size 50*50mm
Substrate thickness dimensions 0.2 ~ 6 mm
Steel mesh frame dimensions 470*370mm~737*737mm
Transmission direction Left in right out, right in left out, same in same out
Cleaning method Dry wipe, wet wipe, vacuum wipe, high-speed cleaning
Power requirement AC:220 ±10%, 50/60Hz 2.2KW
Equipment size L1240mm*W1410mm*H1500mm(without tri-color light)


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