Precision Solder Paste Printing Equipment
Gsemi-S
Product Features
The pursuit of innovation, therefore excellence
1. Universal, meet chip level, substrate level, wafer level and other semiconductor packaging ball planting process;
2. Meet 150um ball diameter, leakage rate ≤0.01% application capacity;
3. Equipped with 6mm*4.8mm, 4.6um resolution high-precision positioning system;
4. Secondary pressure detection of the planting ball module + internal flexible structure design, improve the flow of the tin ball and the stability of the planting ball process;
5. Intelligent monitoring of the whole process of planting balls to ensure the overall stability of the equipment.
