Precision Solder Paste Printing Equipment
Climber series
Product Features
Vision, between dynamic, breakthrough innovation
1.Climber Series ·SL200 wafer planting ball whole line, with trinity wafer printing, transfer loading and unloading, planting ball;
2. Equipped with high-precision UWP vacuum transport structure, the whole process to protect the Wafer in and out of the positioning accuracy;
3. Real-time pressure closed-loop design + dual-drive printing mechanism, stable control pressure at ±0.2KG, controllable H/V tolerance: ±10um, to ensure uniform and consistent substrate Flux/ solder paste transfer;
4. The maximum load of 0.5KG transfer mechanism, automatic taking and discharging materials, intelligent distribution of the whole process to reduce the fragmentation rate, Class100 cleanliness, effectively reduce foreign interference, ensure the yield of good products;
5. Natural rolling filling type planting ball module, equipped with automatic filling ball + automatic recovery ball mechanism, improve efficiency and reduce cost;
6. Compatible with extended SECS/GEM communication protocol, the produced data can be traced at any time, so that quality output and data monitoring seamless connection.
