GD91M6

GD91M6正面-2022-10.png
GD91M6正面-2022-10
GD91M6侧面-2022-10.png
GD91M6侧面-2022-10
  • GD91M6正面-2022-10.png
    GD91M6正面-2022-10
  • GD91M6侧面-2022-10.png
    GD91M6侧面-2022-10
Precision Packaging Equipment
GD91M6
Product Features

1. Adopt the method of 180° rotation of the six bang head.

2. Integrated into the type design, and can complete R, G, B chip solidification;

3. Meet the RGB three kinds of chip mixed row, mixed crystal, mixing and other special process solidification methods;

4. Capacity covers 2*4mil - 20*20mil chips, P0.5-P1.56 and other micro-pitch products;

5. Multiple devices are connected or equipped with a crane scheme to achieve the undifferentiated ratio efficiency of the whole line;

6. Suitable for a variety of practical functions, such as: nozzle cleaning, bottom flapping, code scanning function, mixing function, etc.


Product Application

MiniLED is mainly used in AR/VR, car display, smart wear, HD studio, high-end theater, advertising display, office display and other application fields.

Applicable products: direct display MiniLED, backlight MiniLED, COB, COG, MIP multi-in-one and other flip products.


Product Parameters
GD91M6 MiniLED six high speed adhesive machine
Solid cycle ≥72ms Note: 6-head simultaneous operation UPH: 90-150K/H
(Actual capacity depends on chip and substrate size and process requirements)
Solid position accuracy ±15um
Chip Angle accuracy Plus or minus 2 °
Chip size 2*4-20*20mil
Applicable support size L:150-330mm
W: 60-200mm
Equipment size (L*W*H) 3386 (front length)* 1480(side depth)*2215(height)mm


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