GD91M6L/S

GD91M6L正面.png
GD91M6L正面
GD91M6L侧面.png
GD91M6L侧面
  • GD91M6L正面.png
    GD91M6L正面
  • GD91M6L侧面.png
    GD91M6L侧面
Precision Packaging Equipment
GD91M6L/S
Product Features

1. Split type design, small body, flexible wiring, both arms 180° rotation of solidification mode;

2. Meet the RGB three kinds of chip mixed row, mixed crystal, mixing and other special process solidification method;

3. Capacity covers 2*4mil - 20*20mil chips, P0.5-P1.56 and other micro-pitch products;

4. Meet the connection of multiple devices, and can be equipped with a crane scheme to achieve the entire line of undifferentiated ratio efficiency;

5. Suitable for a variety of practical functions, such as: nozzle cleaning, bottom flapping, code scanning function, mixing function, etc.


Product Application

MiniLED is mainly used in AR/VR, car display, smart wear, HD studio, high-end theater, advertising display, office display and other application fields.

Applicable products: direct display MiniLED, backlight MiniLED, COB, COG, MIP multi-in-one and other flip products.


Product Parameters


GD91M6S automatic high speed solidification machine
Solid cycle

≥72ms Dual-head UPH: 30-50K/H

(Actual capacity depends on chip and substrate size and process requirements)

Solid position accuracy ±15um
Chip Angle accuracy Plus or minus 2 °
Chip size 2*4-20*20mil
Applicable support size L:150-200mm
W: 50-120mm
Equipment dimensions (L*W*H 1176.5 (front length)* 1290(side depth)*2186(height)mm


GD91M6L automatic high speed solidification machine
Solid cycle

≥72ms UPH:30-50K/H

(Actual capacity depends on chip and substrate size and process requirements)

Solid position accuracy ±15um
Chip Angle accuracy Plus or minus 2 °
Chip size 2*4-60*60mil
Applicable support size L: 150-400mm
W: 60-200mm
Equipment dimensions (L*W*H 1390 (front length)* 1530(side depth)*2175(height)mm



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