GD91M2

GD91M2正面.png
GD91M2正面
GD91M2侧面.png
GD91M2侧面
  • GD91M2正面.png
    GD91M2正面
  • GD91M2侧面.png
    GD91M2侧面
Precision Packaging Equipment
GD91M2
Product Features

1. Two arms 180° rotation of solid crystal, split type design;

2. Suitable for small and medium size backlight, large size direct display substrate size: 280*480mm;

3. Meet the RGB three kinds of chip mixed row, mixed crystal, mixing and other special process solidification methods;

4. Capacity covers 2*4mil - 20*20mil chips, P0.5-P1.56 and other micro-pitch products;

5. Multiple devices are connected or equipped with a crane scheme to achieve the undifferentiated ratio efficiency of the whole line;

6. Suitable for a variety of practical functions, such as: nozzle cleaning, bottom flapping, code scanning function, mixing function, etc.


Product Application

MiniLED is mainly used in AR/VR, car display, smart wear, HD studio, high-end theater, advertising display, office display and other application fields.

Applicable products: direct display MiniLED, backlight MiniLED, COB, COG, MIP multi-in-one and other flip products.


Product Parameters
GD91M2 automatic high speed solidification machine
Solid cycle ≥72ms Dual-head UPH: 25-50K/H
(Actual capacity depends on chip and substrate size and process requirements)
Solid position accuracy ±15um
Chip Angle accuracy Plus or minus 2 °
Chip size 3*5-20*20mil
Applicable support size L:150-480mm
W: 100-280mm
Equipment dimensions (L*W*H 3620 (front length)* 1540(side depth)*2202(height)mm


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