GD210

GD210正面.png
GD210正面
GD210侧面.png
GD210侧面
  • GD210正面.png
    GD210正面
  • GD210侧面.png
    GD210侧面
Precision Packaging Equipment
GD210
Product Features

1, the use of two-stage relay solid crystal swing arm 180° rotating suction + gantry welding head mounting,

2, meet the large product substrate size: 600*510mm;

3, configure 10 inch automatic crystal change ring, automatic film expansion function;

4, the ability to achieve mounting accuracy precision mode ±10um&±1°, standard mode ±20um&±3°;

5, suitable for a variety of practical functions, such as: automatic crystal change ring, welding head force control, code scanning function, Mapping to find crystals.


Product Application

Solid crystal equipment for semiconductor field, integrated circuit, consumer electronics, communication system, packaging device applications and other fields.

Adaptive products: Solid crystal of various grain/chip products such as semiconductor field and super size products.


Product Parameters
GD210 high precision large board solid crystal machine
Solid cycle ≥300ms (depending on chip and substrate size and process requirements) 1-2.5mm chip 8-12K/h
2.5~5mm chip 6-10K/h
Solid position accuracy 1~2.5mm chip ±10~15μm
2.5~5mm chip ±15~20μm
Chip Angle accuracy Plus or minus 1 °
Chip size 1*1—5*5mm
Applicable support size L:50-600mm
w:220-510mm
Equipment size (L*W*H) 2780 (front length)* 1436(side depth)*1968.5(height)mm



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