GD212S

GD212S侧面.png
GD212S侧面
  • GD212S侧面.png
    GD212S侧面
Precision Packaging Equipment
GD212S
Product Features

1, the use of two-stage relay solid crystal single swing arm 180° rotation suction + gantry welding head mounting;

2, the use of chip dispensing + solid crystal high-precision mounting process;

3, configure 12 inch automatic film expansion (optional 10 inch /8 inch /6 inch) function capability;

4, the ability to achieve mounting accuracy precision mode ±10um&±1°, standard mode ±20um&±3°;

5, suitable for a variety of practical functions, such as: welding head force control, scanning code function, Mapping crystal.


Product Application

Solid crystal equipment for semiconductor field, integrated circuit, consumer electronics, communication system, packaging device applications and other fields.

Adaptation products: Solid crystal in semiconductor field, QFN, DFN and many other grain/chip products.


Product Parameters
GD212S high precision solidification machine
Solid cycle ≥450ms Precision mode: UPH3~8K/h
           Standard mode: UPH10~15K/h
(Actual capacity depends on chip and substrate size and process requirements)
Solid position accuracy Precision mode: ±10um
Standard mode: ±20um
Chip Angle accuracy Plus or minus 1 °
Chip size Precision mode: 0.2*0.2-5*5mm
Standard mode: 0.2*0.2-9*9mm
Applicable support size L: 120-300mm
W: 50-120mm
Equipment size (L*W*H) 1277 (front length)* 1838 side depth)*2150(height)mm


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