GD612

GKG Asia
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Product & Industry Applications
Precision Packaging Equipment
GD612
Product Features
Product Application
GD612正面.png
GD612正面
GD612侧面.png
GD612侧面
  • GD612正面.png
    GD612正面
  • GD612侧面.png
    GD612侧面
Precision Packaging Equipment
GD612
Product Features

1, the use of two-stage relay solid crystal single swing arm 180° rotation suction + gantry welding head mounting;

2, the ability to achieve mounting accuracy precision mode ±10um&±1°, standard mode ±20um&±3°;

3, configure 12 inch automatic film expansion (optional 10 inch /8 inch /6 inch) function capability;

4, the use of flexible roll-to-roll dispensing + solid crystal high-precision mounting process, product line flexible high-precision mounting;

5, suitable for a variety of practical functions, such as: welding head force control, scanning code function, MES system, Mapping crystal.


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Product Application

Solid crystal equipment for semiconductor field, integrated circuit, consumer electronics, communication system, packaging device applications and other fields.

Adaptation products: Solid crystal in semiconductor field, QFN, DFN and many other grain/chip products.


Product Parameters
GD612 High precision solidification machine
Solid cycle ≥450ms Precision mode: UPH5~8K/h
           Standard mode: UPH10~15K/h
(Actual capacity depends on chip and substrate size and process requirements)
Solid position accuracy Precision mode: ±10um
Standard mode: ±20um
Chip Angle accuracy Precision mode: ±1°
Standard mode: ±3°
Chip size 0.2 * 0.2-9 * 9 mm
Applicable support size L: 100-200mm
W: 50-120mm
Equipment size (L*W*H) 1760 (front length)* 1390(side depth)*2165(height)mm 


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