| GD602D automatic high speed solidification machine | |||||||||
| Solid cycle | ≥72ms UPH:40 ~ 50K/H (Actual capacity depends on chip and substrate size and process requirements) |
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| Solid position accuracy | ±25um | ||||||||
| Chip Angle accuracy | Plus or minus 3 ︒ | ||||||||
| Chip size | 3milx5mil-60milx60mi | ||||||||
| Applicable support size | L:100-600mm W: 80-120mm |
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| Equipment size (L*W*H) | 1234 (front length)* 1296(side depth)*1750(height)mm | ||||||||
| GD602F+ Automatic high speed resistance machine | |||
| Solid cycle | ≥110ms UPH:30 ~ 35K/H (Actual capacity depends on the spacing between mount resistors and the spacing between substrate rows) |
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| Material size | Size 0204 and above | ||
| Feida quantity | 8 groups (bilateral) | ||
| Applicable support size | L:100-600mm W: 80-120mm |
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| Equipment size (L*W*H) | 1212 (front length)* 1294 side depth)*1800(height)mm | ||