G9+

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Precision Solder Paste Printing Equipment
G9+
Product Features

Style is the relentless pursuit of precision technology

1. New adjustable CCD optical path system;

2. Closed-loop pressure feedback system to improve pressure stability and forming effect;

3. Flexible BTB mode, allowing you to have dual channel experience, double speed per unit output;

4. Standard version of Industry 4.0, can provide "customized" services, everything can be connected, everything is in control;


Product Application

Suitable for 3c, laptop, consumer electronics, communication, home appliances and other fields, to meet the characteristics of fine spacing, high precision, high speed and other printing needs. At the same time, the printing process meets the solder paste, FLUX, silver paste, and the process of silica gel, red glue, ink, and glue can also be fully compatible.

Product Parameters
G9+
Repeat printing accuracy ±18um@6σ CPK≥2.0
Maximum substrate size 450*340mm
Minimum substrate size 50*50mm
Substrate thickness dimensions 0.4 ~ 6 mm
Steel mesh frame dimensions 470*370~737*737mm (Thickness: 20-40mm)
Transmission direction Left in right out, right in left out, same in same out
Cleaning method Wet wipe, dry wipe, vacuum wipe, integrated cleaning
Power requirement AC:220 ±10%, 50/60Hz 2.2KW
Equipment size L1172mm*W1385mm*H1530mm(without tri-color light)


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