GT++

GT++正面.png
GT++正面
  • GT++正面.png
    GT++正面
Precision Solder Paste Printing Equipment
GT++
Product Features

1. Equipment capacity covers all electronic products, and the equipment is leading the industry;

2. High-speed mode, flexible wiring layout (BTB+HTH), intelligent options in one;

3. Real-time pressure closed-loop system, real-time pressure correction accuracy ±0.2Kg;

4.GKG integrated central control center + "Customized" Industry 4.0, to achieve industrial intelligence and production process information.


Product Application

Suitable for laptop, aerospace, motherboard, mobile phone and other fields, more compatible with semiconductor, Mini LED and other core growth areas. Meet 01005 and 0.35pitch and other small spacing, multi-solder joints, ultra-high requirements and other process characteristics printing. Face compatible.

Product Parameters
GT++ series
Maximum substrate size 510 x 510mm (Optional: 610 x 510mm)
Minimum substrate size 50*50mm
Substrate thickness dimensions 0.4 ~ 6 mm
Steel mesh frame dimensions 470*370~737*737mm (Thickness: 20-40mm)
Transmission direction Left in right out, right in left out, same in same out
Cleaning method Wet wipe, dry wipe, vacuum wipe, high-speed cleaning
Power requirement AC:220 ±10%, 50/60Hz 2.2KW
Equipment size L1240mm*W1410mm*H1500mm(without tri-color light)


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